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Shanghai Yolanda New Material Co., Ltd. is a leading manufacturer of high-performance electronic components, leveraging deep expertise in advanced materials science to deliver innovative and reliable solutions. -
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CSOP (Ceramic Small Outline Package)
Description:
CSOP, or Ceramic Small Outline Package, is a mainstream micro surface-mount package. Standard specifications typically range from 4 to 36 pins, with custom designs available up to 48 pins. It features a seagull-wing-shaped pin design that reduces stress between the package housing and the PCB caused by mismatched coefficients of thermal expansion during use. The minimum metallized wire diameter can be as small as 0.10 mm, with a standard lead pitch of 1.27 mm. Common narrow pitches include 0.635 mm, 0.65 mm, 0.80 mm, and 0.95 mm. Most products utilize a parallel soldering process, which facilitates lead soldering and is well-suited for high-volume production. In addition to conventional integrated circuits, this package is commonly used for specialized chips with high stability requirements, effectively extending the device’s service life in complex environments.
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CSOP (Ceramic Small Outline Package)
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No. 344, Sanlin Road, Pudong New Area, 200124,Shanghai,China
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