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About Us
Shanghai Yolanda New Material Co., Ltd. is a leading manufacturer of high-performance electronic components, leveraging deep expertise in advanced materials science to deliver innovative and reliable solutions. -
Product
Precision electronic components powering innovation. Engineered for peak performance & reliability in demanding applications. Discover the essential building blocks driving tomorrow's technology. -
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Discover expert insights, practical guides, and the latest trends in electronic components. Stay updated on innovations and essential industry knowledge. Your valuable knowledge hub. -
Industry Cases
Industry Cases
Electronic components power innovation across industries, forming the essential core of modern technology – from 5G to medical electronics, industrial automation, and test measurement etc,. -
Contact
Contact
Wherever you connect with us, rest assured you'll receive the same consistent level of excellent service and personalized dedication to your needs.
Encapsulation of the metal tube shell is one of the important components of microelectronics encapsulation process, this series of products are customized to meet the customer's requirements.
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Featuring glass sintered sealing, excellent airtightness, and sealing interface functionality, this series of products can be customized according to customer requirements.
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Multiple types, including non-50Ω impedance single-core glass sintered gas sealing products, multi-core glass-to-metal seal components and sing-core glass-to-metal seal gas-tight components, and customized service accepted.
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The glass-sealed TO housings provide reliable, permanent protection of the package components from the environment and are customized to meet customer requirements.
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HTCC ceramic packages are formed through co-firing at high temperatures ranging from 1650°C to 1850°C and serve as hermetically sealed ceramic packaging structures for high-end electronic packaging. They are primarily used to protect and support internal electronic chips or components, while also providing electrical connections, heat dissipation, and mechanical protection. These ceramic packages feature high wiring density, high electrical insulation, high thermal conductivity, good thermal matching, and excellent hermeticity. They are indispensable key components in the field of high-end, high-reliability electronic packaging and are particularly suitable for applications with extremely high requirements for environmental tolerance and reliability, such as power devices, RF modules, optoelectronic devices, sensors, and medical electronics.
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Please contact us only through the following methods:
No. 344, Sanlin Road, Pudong New Area, 200124,Shanghai,China
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