CDIP stands for Ceramic Dual-In-Line Package. Standard specifications typically range from 4 to 40 pins, with custom designs available up to 64 pins.

CDIP Ceramic Dual-In-Line Package

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CFP stands for Ceramic Flat Package. The standard number of pins ranges from 6 to 48, with custom configurations available up to 64 pins.

CFP Ceramic Flat Package

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CSOP, or Ceramic Small Outline Package, is a mainstream micro surface-mount package.

CSOP (Ceramic Small Outline Package)

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CLCC stands for Ceramic Leadless Chip Carrier. Standard specifications typically range from 4 to 32 pins, with custom designs capable of up to 84 pins.

CLCC Leadless Chip Carrier

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SMD stands for Surface-Mount Device. These ceramic components are small and lightweight, feature high current-carrying capacity, and have excellent heat dissipation properties in their base plates.

SMD Surface-Mount Device Packages

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CQFN stands for Ceramic Quad Flat No-Lead Package. Standard specifications typically range from 12 to 32 pins, with custom designs available up to 64 pins.

CQFN Ceramic Quad Flat No-Lead Package

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CQFP stands for Ceramic Quad Flat Package. Standard pin counts range from 24 to 64, with custom options available up to 144 pins.

CQFP Ceramic Quad Flat Package

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CPGA stands for Ceramic Pin Grid Array packaging. Standard specifications typically range from 28 to 68 pins, with custom designs available up to 94 pins. The package is square or rectangular in shape, with pins arranged in an array on the bottom.

CPGA/CBGA Ceramic Pin Grid/Ball Grid Array Packages

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