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CFP Ceramic Flat Package
Description:
CFP stands for Ceramic Flat Package. The standard number of pins ranges from 6 to 48, with custom configurations available up to 64 pins. The leads utilize a through-wall interconnection method, with metal leads bent horizontally downward to the bottom surface to form a seagull-wing lead structure. This design can be modified to include a heat sink baseplate, making it suitable for high-density circuit assembly. The metallized wire diameter can be as small as 0.08 mm, and the standard lead pitch is 1.27 mm. with mainstream narrow lead spacings including 0.50 mm, 0.65 mm, and 0.80 mm. Some special models support an ultra-narrow lead spacing of 0.40 mm. Most products utilize a gold-tin sealing process and are widely used in 5G communications, precision medical instruments, and electronic devices.
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CFP Ceramic Flat Package
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