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CDIP Ceramic Dual-In-Line Package
Description:
CDIP stands for Ceramic Dual-In-Line Package. Standard specifications typically range from 4 to 40 pins, with custom designs available up to 64 pins. The pins are arranged in two symmetrical rows, making it suitable for chips of varying functional complexity. The minimum metallization line width is 0.10 mm, and the standard lead pitch is 2.54 mm. It is available in various cavity configurations, including single-cavity, dual-cavity, quad-cavity, and multi-cavity designs. Its applications are quite extensive, including integrated circuit packaging for electrical coupling devices, digital logic chips, and small optoelectronic modules. It is a highly reliable packaging option for low-frequency signal transmission.
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CDIP Ceramic Dual-In-Line Package
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