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Shanghai Yolanda New Material Co., Ltd. is a leading manufacturer of high-performance electronic components, leveraging deep expertise in advanced materials science to deliver innovative and reliable solutions. -
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TO56-06-01
Description：
This series of TO package provides the mechanical foundation for mounting electronic and optical components such as semiconductors, laser diodes, sensors, and simple electronic circuits, while providing electrical signals to the packaged component through the leads for high-speed data transmission. The glass-sealed TO housings provide reliable, permanent protection of the package components from the environment and are customized to meet customer requirements.
Application:
This series is widely used in optical communication signaling, lasers, sensors and other packages.
Features:
--Small structure
--High reliability
--Good hermeticity
Ordering Symbol:
TO56 - 03 -*
① ② ③
① Primary Code: TO8 Series, TO9 Series,TO18 Series, TO25 Series, TO33 Series, TO35 Series, TO38 Series, TO39 Series, TO40 Series, TO46 Series, TO5 Series, TO56 Series, TO60 Series, TO63 Series ;
② Number of Leads: 01, 02, 03, 04, 05, 06, 07, 08, 09;
③ Retrofit Marking: 01, 02, 03
Main Performance Indicators:
Items | Indicators | |
Insulation resistance | ≥1000M Ω( 100VDC) | |
Leak rate | ≤1*10-3Pa.cm3 /s (He) | |
Operating Temperature Range | -65°C ~ +165°C | |
Solderability | Flawless Tinning on Leads with Over 95% Surface Area Coated | |
Salt spray | 5% Sodium Chloride (NaCl), 24 Hours, Surface Rust Area Less Than 5% of Total Base Area | |
Bond strength | Gold Wire 25μm, Tensile Force > 3gf | |
Lead fatigue
| Bend Cycling Test: 90° ±5° Bending Angle, 3 Cycles; Leak Rate ≤ 1*10-3Pa.cm3 /s(He); No Lead Breakage or Looseness | |
Materials and Surface Coating | ||
Name | Material | Surface Coating |
Housing | SPCC, Kovar | Electroplated Nickel/Chemical Plated Nickel + Gold Plating/Silver Plating |
Lead | Kovar,Iron-Nickel Alloy | Electroplated Nickel/Chemical Plated Nickel + Gold Plating/Silver Plating |
Insulating Medium | Glass | / |
Others | Weldable Aluminum Oxide and Aluminum Nitride Ceramic Substrates | |
In the demanding world of aerospace and defense, reliability is non-negotiable. Electronic systems must perform flawlessly under extreme conditions, from the vacuum of space to the corrosive environments of marine applications. This is where the Hermetic IC Package becomes a cornerstone of modern engineering. By providing an absolute barrier against external gases and moisture, this packaging technology ensures the long-term integrity and functionality of sensitive microelectronics. Its role is critical in satellites, avionics, and military communication systems, where a single component failure can have significant consequences. The application of a Hermetic IC Package is a fundamental step in guaranteeing that these advanced systems operate as intended, mission after mission.
The medical device industry, particularly for implantable technologies, presents one of the most challenging environments for electronics. Devices such as pacemakers, neurostimulators, and advanced hearing aids reside inside the human body, exposed to moisture and ionic contaminants. The use of a Hermetic IC Package is paramount to creating a biocompatible and durable enclosure that protects the intricate silicon die and wire bonds from these harsh conditions. This protection is not just about device longevity; it is directly tied to patient safety and therapeutic efficacy. The robust nature of a Hermetic IC Package ensures that these life-sustaining devices remain reliable over many years, preventing harmful failures and maintaining precise performance standards.
Beyond these high-stakes fields, the industrial sector leverages the robustness of the Hermetic IC Package for automation and control systems. In manufacturing plants, oil and gas refineries, and power generation facilities, electronics are subjected to wide temperature swings, high humidity, and exposure to corrosive chemicals. Sensors, power converters, and control modules housed within a Hermetic IC Package can withstand these aggressive operational environments. This resilience minimizes downtime and maintenance costs, supporting continuous and efficient industrial processes. The strategic integration of a Hermetic IC Package is thus a key factor in building the resilient industrial infrastructure that powers the global economy.
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No. 344, Sanlin Road, Pudong New Area, 200124,Shanghai,China