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TO56-03-02
Description：
This series of TO package provides the mechanical foundation for mounting electronic and optical components such as semiconductors, laser diodes, sensors, and simple electronic circuits, while providing electrical signals to the packaged component through the leads for high-speed data transmission. The glass-sealed TO housings provide reliable, permanent protection of the package components from the environment and are customized to meet customer requirements.
Application:
This series is widely used in optical communication signaling, lasers, sensors and other packages.
Features:
--Small structure
--High reliability
--Good hermeticity
Ordering Symbol:
TO56 - 03 -*
① ② ③
① Primary Code: TO8 Series, TO9 Series,TO18 Series, TO25 Series, TO33 Series, TO35 Series, TO38 Series, TO39 Series, TO40 Series, TO46 Series, TO5 Series, TO56 Series, TO60 Series, TO63 Series ;
② Number of Leads: 01, 02, 03, 04, 05, 06, 07, 08, 09;
③ Retrofit Marking: 01, 02, 03
Main Performance Indicators:
Items | Indicators | |
Insulation resistance | ≥1000M Ω( 100VDC) | |
Leak rate | ≤1*10-3Pa.cm3 /s (He) | |
Operating Temperature Range | -65°C ~ +165°C | |
Solderability | Flawless Tinning on Leads with Over 95% Surface Area Coated | |
Salt spray | 5% Sodium Chloride (NaCl), 24 Hours, Surface Rust Area Less Than 5% of Total Base Area | |
Bond strength | Gold Wire 25μm, Tensile Force > 3gf | |
Lead fatigue
| Bend Cycling Test: 90° ±5° Bending Angle, 3 Cycles; Leak Rate ≤ 1*10-3Pa.cm3 /s(He); No Lead Breakage or Looseness | |
Materials and Surface Coating | ||
Name | Material | Surface Coating |
Housing | SPCC, Kovar | Electroplated Nickel/Chemical Plated Nickel + Gold Plating/Silver Plating |
Lead | Kovar,Iron-Nickel Alloy | Electroplated Nickel/Chemical Plated Nickel + Gold Plating/Silver Plating |
Insulating Medium | Glass | / |
Others | Weldable Aluminum Oxide and Aluminum Nitride Ceramic Substrates | |
Introducing our state-of-the-art Hermetic Microelectronics Package, designed to meet the demands of high-performance electronics in challenging environments. The Hermetic Microelectronics Package offers unparalleled protection against moisture, dust, and corrosive elements, ensuring that your sensitive components remain safe and operational under the most extreme conditions. With a focus on reliability and durability, this package is ideal for aerospace, military, and medical applications where failure is not an option.
The construction of the Hermetic Microelectronics Package employs advanced materials and sealing techniques, which provide an airtight barrier that prevents contamination from external factors. This hermetic sealing process is crucial for preserving the integrity of microelectronic devices, especially in environments subject to high humidity and temperature fluctuations. By utilizing the Hermetic Microelectronics Package, manufacturers can significantly enhance the lifespan and performance of their electronic systems, ensuring consistent operation over time.
In addition to its protective features, the Hermetic Microelectronics Package is designed for easy integration into existing systems. Its lightweight yet robust design allows for versatile applications across various industries, making it a preferred choice for engineers and designers seeking reliable solutions. The Hermetic Microelectronics Package not only safeguards your valuable microelectronics but also contributes to overall system efficiency and effectiveness. Trust in our Hermetic Microelectronics Package to deliver the performance you need.
Whether you're developing cutting-edge technology for the next generation of satellites or creating medical devices that save lives, the Hermetic Microelectronics Package is the solution you've been searching for. Experience the difference that a quality hermetic seal can make in your products. Invest in a Hermetic Microelectronics Package today and ensure your electronics are protected against the harshest environments while maintaining peak performance throughout their operational life.
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No. 344, Sanlin Road, Pudong New Area, 200124,Shanghai,China