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TO63-03-01
Description：
This series of TO package provides the mechanical foundation for mounting electronic and optical components such as semiconductors, laser diodes, sensors, and simple electronic circuits, while providing electrical signals to the packaged component through the leads for high-speed data transmission. The glass-sealed TO housings provide reliable, permanent protection of the package components from the environment and are customized to meet customer requirements.
Application:
This series is widely used in optical communication signaling, lasers, sensors and other packages.
Features:
--Small structure
--High reliability
--Good hermeticity
Ordering Symbol:
TO56 - 03 -*
① ② ③
① Primary Code: TO8 Series, TO9 Series,TO18 Series, TO25 Series, TO33 Series, TO35 Series, TO38 Series, TO39 Series, TO40 Series, TO46 Series, TO5 Series, TO56 Series, TO60 Series, TO63 Series ;
② Number of Leads: 01, 02, 03, 04, 05, 06, 07, 08, 09;
③ Retrofit Marking: 01, 02, 03
Main Performance Indicators:
Items | Indicators | |
Insulation resistance | ≥1000M Ω( 100VDC) | |
Leak rate | ≤1*10-3Pa.cm3 /s (He) | |
Operating Temperature Range | -65°C ~ +165°C | |
Solderability | Flawless Tinning on Leads with Over 95% Surface Area Coated | |
Salt spray | 5% Sodium Chloride (NaCl), 24 Hours, Surface Rust Area Less Than 5% of Total Base Area | |
Bond strength | Gold Wire 25μm, Tensile Force > 3gf | |
Lead fatigue
| Bend Cycling Test: 90° ±5° Bending Angle, 3 Cycles; Leak Rate ≤ 1*10-3Pa.cm3 /s(He); No Lead Breakage or Looseness | |
Materials and Surface Coating | ||
Name | Material | Surface Coating |
Housing | SPCC, Kovar | Electroplated Nickel/Chemical Plated Nickel + Gold Plating/Silver Plating |
Lead | Kovar,Iron-Nickel Alloy | Electroplated Nickel/Chemical Plated Nickel + Gold Plating/Silver Plating |
Insulating Medium | Glass | / |
Others | Weldable Aluminum Oxide and Aluminum Nitride Ceramic Substrates | |
The hermetic microelectronics package is engineered to deliver superior protection for delicate electronic components used in demanding industries. Designed with airtight sealing technology, the hermetic microelectronics package shields sensitive devices from moisture, oxygen, and other environmental contaminants that could compromise their performance. It is an ideal solution for aerospace, defense, and medical electronics where reliability is paramount.
Built from high-quality metals and ceramics, the hermetic microelectronics package provides both durability and stability. Its robust construction ensures long-term performance, while the hermetic seal maintains a controlled internal environment. This design not only safeguards circuits but also enhances the overall lifespan of the integrated devices.
The versatility of the hermetic microelectronics package allows it to be tailored for different applications. From hybrid circuits and sensors to optical devices and power modules, it offers customizable configurations to meet specialized engineering requirements.
With proven reliability, the hermetic microelectronics package has become a trusted choice for industries that demand uncompromising protection. By ensuring consistent performance in critical environments, it plays a vital role in advancing next-generation technologies.
Keywords:
advanced hermetic microelectronics package
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No. 344, Sanlin Road, Pudong New Area, 200124,Shanghai,China