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Shanghai Yolanda New Material Co., Ltd. is a leading manufacturer of high-performance electronic components, leveraging deep expertise in advanced materials science to deliver innovative and reliable solutions. -
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CPGA/CBGA Ceramic Pin Grid/Ball Grid Array Packages
Description:
CPGA stands for Ceramic Pin Grid Array packaging. Standard specifications typically range from 28 to 68 pins, with custom designs available up to 94 pins. The package is square or rectangular in shape, with pins arranged in an array on the bottom. It is compatible with through-hole soldering or socket connections, offering excellent heat dissipation and electromagnetic interference (EMI) resistance. The minimum metallized line width can be as small as 0.10 mm, with a standard pitch of 2.54 mm. with a mainstream narrow pitch of 1.27 mm, enabling higher-density pin distribution.
CBGA stands for Ceramic Ball Grid Array. Standard pin counts range from 18 to 77, with custom options available up to 150 pins. Pins are arranged in an array on the bottom of the package, supporting flip-chip mounting. It features low parasitic parameters and excellent thermal dissipation. The minimum metallization line width can be as small as 0.10 mm, with specified pitch values of 0.40 mm, 0.50 mm, 0.65 mm, and 0.80 mm; the mainstream narrow pitch is 0.10 mm, meeting the compact layout requirements of high-end chips. These products are used in the packaging of high-density, high-performance devices—such as early-generation high-end CPUs—that demand extremely high reliability.
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CPGA/CBGA Ceramic Pin Grid/Ball Grid Array Packages
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No. 344, Sanlin Road, Pudong New Area, 200124,Shanghai,China
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