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About Us
Shanghai Yolanda New Material Co., Ltd. is a leading manufacturer of high-performance electronic components, leveraging deep expertise in advanced materials science to deliver innovative and reliable solutions. -
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Precision electronic components powering innovation. Engineered for peak performance & reliability in demanding applications. Discover the essential building blocks driving tomorrow's technology. -
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TO5-08-02
The TO Packages family represents the gold standard for hermetic encapsulation of semiconductor devices, offering a rugged, thermally efficient, and electrically reliable housing that protects sensitive chips from moisture, contamination, and mechanical stress. Available in standard industry footprints—TO-3, TO-5, TO-8, TO-18, TO-39, TO-46, TO-56, and TO-220 variants—these TO Packages are precision-stamped or machined from copper, steel, or Kovar alloys, with nickel/gold or tin-plated leads for solderability and corrosion resistance. Whether used for power transistors, laser diodes, photodetectors, MEMS sensors, or RF ICs, each TO Packages design incorporates a glass-to-metal seal (or ceramic-to-metal for ultra-high-reliability grades) that guarantees leak rates below 1×10⁻⁸ atm·cc/s He, ensuring decades of stable operation in automotive, industrial, aerospace, and medical implantable applications. The inherent coaxial-like lead geometry of many TO Packages also supports low-inductance paths up to several gigahertz, making them a preferred choice for high-speed analog and mixed-signal circuits.
Thermal management is where TO Packages truly excel, thanks to their integral copper or aluminum base tabs that directly interface with heatsinks or PCB thermal vias. With junction-to-case thermal resistance (RθJC) as low as 0.5 °C/W for large-base TO Packages, these enclosures efficiently dissipate power from IGBTs, MOSFETs, and high-brightness LEDs, allowing continuous operation at junction temperatures up to +200°C. Advanced TO Packages now feature exposed paddle designs and multi-lead configurations (up to 24 pins) for enhanced current-carrying capacity (up to 50 A per pin) and reduced parasitic inductance. For optoelectronic TO Packages, integrated flat windows or ball lenses enable precise optical alignment for 850–1650 nm wavelengths, while hermetic feedthroughs maintain seal integrity despite repeated thermal shock (MIL-STD-883, Method 1011). Every batch of TO Packages undergoes 100% fine/gross leak testing, temperature cycling, and electrical continuity checks, ensuring that the TO Packages you receive are production-ready for both manual and automated pick-and-place assembly.
Beyond performance, TO Packages offer unparalleled design flexibility with customizable lead counts, diameters, standoff heights, and internal cavity dimensions—accommodating die sizes from 0.5 mm² to 20 mm². Optional internal getters (for oxygen/moisture absorption) and anti-reflective coatings further tailor TO Packages for laser or detector applications, while nickel-barrier plating prevents gold-tin embrittlement during reflow soldering (peak 260°C). Our engineering team provides full 3D CAD models and thermal simulation reports for each TO Packages variant, enabling you to optimize PCB layout and heatsink selection before prototyping. With lead times as short as 2 weeks for standard TO Packages and 4–6 weeks for custom footprints, we support rapid iteration from concept to volume production. Additionally, RoHS-compliant and REACH-ready TO Packages are available with tin-bismuth or pure tin lead finishes, eliminating hazardous substances without compromising solder joint reliability.
In summary, TO Packages are more than just metal cans—they are mission-critical enclosures that bridge chip-level performance with system-level durability. From low-noise preamplifiers in satellite transceivers to high-power motor drivers in electric vehicles, our TO Packages deliver consistent hermeticity, low thermal impedance, and high-frequency signal integrity across every unit. We back every shipment with full traceability, including material certificates, X-ray inspection, and dimensional metrology reports. Choose our TO Packages for your next-generation designs and experience the peace of mind that comes from decades of process maturity, rigorous quality control, and a global supply chain that never compromises on reliability. Whether you need 100 pieces for R&D or 100,000 for mass production, our TO Packages are engineered to exceed your expectations—seal by seal, lead by lead, and system by system.
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No. 344, Sanlin Road, Pudong New Area, 200124,Shanghai,China
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