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Hermetic Sealed Package : Protects high-precision photosensitive chips, ensuring the accuracy and long-term stability of weak light signal measurements.
Precision optoelectronic detectors have extremely high requirements for sealing accuracy, necessitating control of sealing temperature and optimization of interface bonding strength. For example, the packaging of MEMS devices (such as sensors and actuators) requires low-temperature sealing technology to enhance reliability while ensuring sealing.
Typical application scenarios
Uncooled infrared detectors : Ceramic packaging housings are widely used in such devices, combining mechanical protection with thermal stability.
Fiber lasers / radar microwave components : Low-temperature bonding of glass is required to achieve precise assembly and hermetic protection of components.
Quantum detectors (such as InGaAs single-photon detectors) : Coaxial, butterfly, and other packaging forms are used to ensure precise alignment of optical paths.
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