TO9-04-01

This series is widely used in optical communication signaling, lasers, sensors and other packages.

Classification:

Description:

This series of TO package provides the mechanical foundation for mounting electronic and optical components such as semiconductors, laser diodes, sensors, and simple electronic circuits, while providing electrical signals to the packaged component through the leads for high-speed data transmission. The glass-sealed TO housings provide reliable, permanent protection of the package components from the environment and are customized to meet customer requirements.

 

Application:

This series is widely used in optical communication signaling, lasers, sensors and other packages.

 

Features:

--Small structure 
--High reliability 
--Good hermeticity

 

Ordering Symbol:

TO56 - 03 -*
①           ②  ③ 
① Primary Code: TO8 Series, TO9 Series,TO18 Series, TO25 Series, TO33 Series, TO35 Series, TO38 Series, TO39 Series, TO40 Series, TO46 Series, TO5 Series, TO56 Series, TO60 Series, TO63 Series ; 
② Number of Leads: 01, 02, 03, 04, 05, 06, 07, 08, 09;
③ Retrofit Marking: 01, 02, 03

 

Main Performance Indicators:

Items

Indicators

Insulation 

resistance

≥1000M Ω( 100VDC)

Leak rate 

≤1*10-3Pa.cm3 /s (He)

Operating Temperature Range

-65°C ~ +165°C

Solderability

Flawless Tinning on Leads with Over 95% Surface Area Coated

Salt spray

5% Sodium Chloride (NaCl), 24 Hours, Surface Rust Area Less Than 5% of Total Base Area

Bond strength

Gold Wire 25μm, Tensile Force > 3gf 

Lead fatigue 

 

Bend Cycling Test: 90° ±5° Bending Angle, 3 Cycles; 

Leak Rate ≤ 1*10-3Pa.cm3 /s(He); No Lead Breakage or Looseness

Materials and Surface Coating

Name

Material

Surface Coating

Housing

SPCC, Kovar

Electroplated Nickel/Chemical Plated 

Nickel + Gold Plating/Silver Plating

Lead

Kovar,Iron-Nickel Alloy

Electroplated Nickel/Chemical Plated 

Nickel + Gold Plating/Silver Plating

Insulating Medium

Glass

/

Others

Weldable Aluminum Oxide and Aluminum Nitride Ceramic Substrates

FAQ:

What range of pin specifications can you customize?

  • We support customization for various pin diameters (e.g., 0.45mm, 0.5mm) and any length. Pin materials can be selected from Kovar, Iron-Nickel, or copper-core composites depending on your soldering or bonding needs, with gold plating options for maximum reliability.

 

Can Yolanda customize specific pinouts or lengths if my project requires it

  • Certainly. With our in-house tooling center, we support customized non-standard pin configurations (3-pin, 4-pin, or more)and any pin length. We maintain flexible MOQs to assist you in rapid prototyping and verification during the R&D stage.

 

Do Yolanda’s header products comply with environmental reliability standards?

  • Our designs meet international standards. Every batch undergoes rigorous thermal shock (-65°C to +175°C) and damp heat testing, ensuring long-term stability in outdoor or aerospace equipment.

 

 

How do you ensure signal purity for high-frequency sensing applications?

  • We use high-purity, low-dielectric-loss glass preforms and precisely control sealing gaps. This design effectively minimizes parasitic capacitance and signal interference between pins, ensuring accurate high-frequency data transmission.

 

Do your pin coatings support Gold Wire Bonding?

  • Yes. We offer Electrolytic or Electroless Gold plating compliant with MIL-G-45204. Plating thickness is customizable (up to 3μm) based on your process requirements. Our high-purity gold layer ensures excellent wettability, significantly improving your wire bonding success rate.

 

Can Yolanda provide TO-CAN integrated with lenses for optical applications?

  • Yes. We provide headers integrated with flat windows, ball lenses, or aspherical lenses. Our precision sealing ensures lens coaxiality and hermeticity, reducing your assembly complexity and improving overall system coupling efficiency.

Modern electronic devices require stable and durable semiconductor solutions, and TO Transistor Packages continue to play an important role in many industrial and commercial applications. Designed to provide strong mechanical protection and efficient thermal performance, TO Transistor Packages are widely used in power management systems, communication equipment, automotive electronics, and industrial control devices. Their compact metal structure helps improve reliability while protecting sensitive transistor components from environmental influence.

One of the key advantages of TO Transistor Packages is their excellent heat dissipation capability. During continuous operation, electronic systems often generate heat that can affect performance and lifespan. The solid metal housing used in TO Transistor Packages helps transfer heat more effectively, allowing devices to maintain stable working conditions. This makes them suitable for applications that require long operating hours and dependable electrical performance. In addition, the package structure supports easy installation and compatibility with different circuit board designs.

As electronic products become smaller and more advanced, manufacturers continue to choose TO Transistor Packages for their balance of durability and compact design. These packages are commonly found in amplifiers, switching devices, voltage regulators, and sensor systems. Different configurations and pin layouts are available to meet various technical requirements, giving engineers greater flexibility during product development. The stable sealing performance of TO Transistor Packages also helps protect internal semiconductor parts from moisture, dust, and external interference, improving long-term operational reliability.

The growing demand for efficient electronic solutions has further increased the importance of TO Transistor Packages in global markets. Their strong structure, reliable electrical connection, and consistent thermal management make them a practical option for modern semiconductor applications. Whether used in industrial automation equipment or consumer electronics, TO Transistor Packages continue to support stable system performance while meeting the evolving needs of advanced electronic manufacturing.

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