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quality hermetic microelectronics package
Category：
Knowledge
Release Time：
2025-09-10
Description：
This series of TO package provides the mechanical foundation for mounting electronic and optical components such as semiconductors, laser diodes, sensors, and simple electronic circuits, while providing electrical signals to the packaged component through the leads for high-speed data transmission. The glass-sealed TO housings provide reliable, permanent protection of the package components from the environment and are customized to meet customer requirements.
Application:
This series is widely used in optical communication signaling, lasers, sensors and other packages.
Features:
--Small structure
--High reliability
--Good hermeticity
Ordering Symbol:
TO56 - 03 -*
① ② ③
① Primary Code: TO8 Series, TO9 Series,TO18 Series, TO25 Series, TO33 Series, TO35 Series, TO38 Series, TO39 Series, TO40 Series, TO46 Series, TO5 Series, TO56 Series, TO60 Series, TO63 Series ;
② Number of Leads: 01, 02, 03, 04, 05, 06, 07, 08, 09;
③ Retrofit Marking: 01, 02, 03
Main Performance Indicators:
Items | Indicators | |
Insulation resistance | ≥1000M Ω( 100VDC) | |
Leak rate | ≤1*10-3Pa.cm3 /s (He) | |
Operating Temperature Range | -65°C ~ +165°C | |
Solderability | Flawless Tinning on Leads with Over 95% Surface Area Coated | |
Salt spray | 5% Sodium Chloride (NaCl), 24 Hours, Surface Rust Area Less Than 5% of Total Base Area | |
Bond strength | Gold Wire 25μm, Tensile Force > 3gf | |
Lead fatigue
| Bend Cycling Test: 90° ±5° Bending Angle, 3 Cycles; Leak Rate ≤ 1*10-3Pa.cm3 /s(He); No Lead Breakage or Looseness | |
Materials and Surface Coating | ||
Name | Material | Surface Coating |
Housing | SPCC, Kovar | Electroplated Nickel/Chemical Plated Nickel + Gold Plating/Silver Plating |
Lead | Kovar,Iron-Nickel Alloy | Electroplated Nickel/Chemical Plated Nickel + Gold Plating/Silver Plating |
Insulating Medium | Glass | / |
Others | Weldable Aluminum Oxide and Aluminum Nitride Ceramic Substrates | |
A hermetic microelectronics package is a specialized enclosure developed to secure sensitive microelectronic assemblies against environmental hazards. Through advanced sealing methods, the hermetic microelectronics package provides complete isolation from dust, humidity, and chemical exposure, making it indispensable for mission-critical applications.
This package is constructed using precision-engineered materials such as kovar, ceramics, and specialized alloys, which guarantee mechanical strength and thermal stability. The hermetic microelectronics package not only protects internal circuits but also ensures reliable electrical performance under extreme conditions.
Widely used in telecommunications, military systems, and space exploration, the hermetic microelectronics package is valued for its ability to maintain integrity over long service lives. It supports complex designs, including high-frequency and high-power applications, where even minor contamination can cause serious failures.
For manufacturers seeking dependable housing solutions, the hermetic microelectronics package represents an optimal balance of protection, durability, and customization. Its consistent performance and adaptability make it an essential component in modern high-reliability electronics.
Key Words:
hermetic microelectronics package
For more information
Please contact us only through the following methods:
No. 344, Sanlin Road, Pudong New Area, 200124,Shanghai,China
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