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TO60-08-07
Description：
This series of TO package provides the mechanical foundation for mounting electronic and optical components such as semiconductors, laser diodes, sensors, and simple electronic circuits, while providing electrical signals to the packaged component through the leads for high-speed data transmission. The glass-sealed TO housings provide reliable, permanent protection of the package components from the environment and are customized to meet customer requirements.
Application:
This series is widely used in optical communication signaling, lasers, sensors and other packages.
Features:
--Small structure
--High reliability
--Good hermeticity
Ordering Symbol:
TO56 - 03 -*
① ② ③
① Primary Code: TO8 Series, TO9 Series,TO18 Series, TO25 Series, TO33 Series, TO35 Series, TO38 Series, TO39 Series, TO40 Series, TO46 Series, TO5 Series, TO56 Series, TO60 Series, TO63 Series ;
② Number of Leads: 01, 02, 03, 04, 05, 06, 07, 08, 09;
③ Retrofit Marking: 01, 02, 03
Main Performance Indicators:
Items | Indicators | |
Insulation resistance | ≥1000M Ω( 100VDC) | |
Leak rate | ≤1*10-3Pa.cm3 /s (He) | |
Operating Temperature Range | -65°C ~ +165°C | |
Solderability | Flawless Tinning on Leads with Over 95% Surface Area Coated | |
Salt spray | 5% Sodium Chloride (NaCl), 24 Hours, Surface Rust Area Less Than 5% of Total Base Area | |
Bond strength | Gold Wire 25μm, Tensile Force > 3gf | |
Lead fatigue
| Bend Cycling Test: 90° ±5° Bending Angle, 3 Cycles; Leak Rate ≤ 1*10-3Pa.cm3 /s(He); No Lead Breakage or Looseness | |
Materials and Surface Coating | ||
Name | Material | Surface Coating |
Housing | SPCC, Kovar | Electroplated Nickel/Chemical Plated Nickel + Gold Plating/Silver Plating |
Lead | Kovar,Iron-Nickel Alloy | Electroplated Nickel/Chemical Plated Nickel + Gold Plating/Silver Plating |
Insulating Medium | Glass | / |
Others | Weldable Aluminum Oxide and Aluminum Nitride Ceramic Substrates | |
The Hermetic IC Package is a state-of-the-art solution for protecting integrated circuits in demanding environments. Designed to provide exceptional sealing and isolation, the Hermetic IC Package ensures that sensitive components remain safe from moisture, dust, and other contaminants. This level of protection is crucial for applications in aerospace, medical devices, and military systems where reliability is paramount.
One of the standout features of the Hermetic IC Package is its robust construction, which includes high-quality materials that withstand extreme temperatures and pressures. This durability allows the Hermetic IC Package to perform reliably even in the most challenging conditions. Engineers and designers can trust that their delicate electronic components will be well-protected, enhancing the overall lifespan and performance of their products.
Additionally, the Hermetic IC Package offers excellent thermal management capabilities. By dissipating heat effectively, it helps maintain optimal operating conditions for integrated circuits. This is particularly important in high-performance applications where overheating can lead to failure. The Hermetic IC Package not only safeguards the integrity of the IC but also enhances its operational efficiency, making it an indispensable choice for engineers seeking dependable solutions.
In summary, the Hermetic IC Package is an ideal choice for those who require uncompromised protection and performance in their electronic designs. With its superior sealing properties, robust construction, and effective thermal management, the Hermetic IC Package meets the rigorous demands of modern technology. Choose the Hermetic IC Package to ensure your integrated circuits are shielded from environmental hazards, allowing you to focus on innovation and performance in your projects.
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No. 344, Sanlin Road, Pudong New Area, 200124,Shanghai,China