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MDFM1717-W3
Description：
This series of products is the use of metal as a shell or base, the chip is mounted directly or through the substrate in the shell or base, the lead through the metal shell or base using the glass-to-metal sealing technology of a form of electronic encapsulation; encapsulation of the metal tube shell is one of the important components of microelectronics encapsulation process, this series of products are customized to meet the customer's requirements.
Application:
This series of products are widely used in optical communications, aerospace, petrochemical industry, automotive, medical and other fields.
Features:
--High reliability
--High mechanical strength
--Good heat dissipation
--Good electromagnetic shielding
--Good sealing
--High degree of integration
Ordering symbols:
M D FM 3030 - W 12 A
① ② ③ ④ ⑤ ⑥ ⑦
① Indication of housing body material: M for metal housing
② Location of lead-out terminal:
Code | Connotation | Description |
B | Bottom | The lead-out terminal extends from the bottom of the package |
D | Two columns | Lead-out terminals are located on the sides ofthe package,arranged in two symmetric rows along the oppositeedges or on both sides of the bottom |
E | End | The lead-out terminal features circular or elliptical cross-sections,serving as the package end |
Q | Four sides | Lead-out terminals are arranged along all four sides of the package |
S | Single column | The lead-out terminals are positioned in a singular unit configuration on the sides or the underside of the package |
T | Three sides | The lead-out terminals are situated along three sides of a square or rectangular package |
U | UP | The lead-out terminals are perpendicular and reversed relative to the base plane,residing on one surface of the package |
X | Others | The lead-out terminals are not located as described above |
③ Package form:
Code | Description |
CY | Circular housing |
FM | Flanged housing |
FO | Fiber-optic device housing |
FP | Flat housing |
GA | Array package |
IP | Plug-in housing |
PM | Bolted housing |
SS | Other special shaped housings |
④ Base size:Refers to the dimensions of the package base,excluding the leads, cover or caps. For rectangular housing,this is expressed as "L*W". In the case of circular housing, the base size is indicated by diameter.
⑤ Lead form:
Code | Connotation | Description |
D | Leads with soldering lugs | Housing with soldering lugs |
F | Flat Leads | Flat leads extended parallel to the sealing surface,remaining unmolded |
N | Leadless | The solder joints for metalized lead-out terminals are located on package substrate |
P | Pin/post | Annealed leads are routed from the package substrate and soldered to the electroplated through-hole pad |
T | Through-hole | Flat or V-profiled leads are extended from the package substrate and soldered to the electroplated through-hole pad |
W | Lead | The unannealed leads extend out of the package |
X | Other | Lead forms or lead-out terminal shapes that do not fall under the aforementioned definition |
⑥ Lead count:This denotes the actual number of leads protruding from the package.In cases where there are no leads,the count of lead-out terminals is used as reference.
⑦ Option:Where the housing is a flanged one of a cavity type,it can be denoted by BF.If two or more types of shells have only localized structural differences and appear to be numbered the same according to this rule, the lower case letters a/b/c (and so on) are marked at the end to indicate the difference.
Code | Description |
A | With assembly bolts |
B | Regarding the cavity or side wall,B cannot be used because the FP is extracted from the sides of the housing(two,three,or four sides) |
D | Dual-row leads on the same side |
H | Integral heat sink |
N | Leads from narrow rectangular surfaces |
P | Flat bottom surface |
W | Transparent light window |
| Note:Markings such as a,b,c,d,etc.,are appended to the codes to distinguish between items with identical numbers but differing structures | |
Main Performance Indicators:
| Items | Indicators | |
| Insulation resistance | ≥1*10¹⁰Ω(500VDC) | |
Operating Temperature Range | -55℃~+125℃ | |
| Leak rate | ≤1.013*10-³Pa.cm³/s(He) | |
| Salt spray | The duration is≥24 hours (which can be extended to 48 hours or 96 hours based on customer requirements) | |
| Bond strength | Gold wire of 25μm diameter,with tensile force≥3 gf | |
Materials and Surface Coating | ||
Name | Material | Surface Coating |
| Housing | Kovar , #10 steel, stainless steel | Nickel plating &gold plating/To be chosen based on customer requirements
|
| Lead | Kovar, Fe-Nickel alloy, copper core composite | |
| Insulating Medium | Glass | / |
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No. 344, Sanlin Road, Pudong New Area, 200124,Shanghai,China