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About Us
Shanghai Yolanda New Material Co., Ltd. is a leading manufacturer of high-performance electronic components, leveraging deep expertise in advanced materials science to deliver innovative and reliable solutions. -
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Precision electronic components powering innovation. Engineered for peak performance & reliability in demanding applications. Discover the essential building blocks driving tomorrow's technology. -
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Radar system
Application Overview
High-frequency device packaging: Provides a wide operating temperature range, vibration resistance, airtightness, and vacuum compatibility to ensure radar performance.
In LoP packaging technology, the silicon wafer is completely encapsulated within the packaging material, while RF signals are transmitted directly through bumps on the chip, passing through the packaging substrate into the radiating elements. These radiating elements cleverly utilize the PCB's waveguide design to transmit RF signals losslessly into the 3D antenna. This direct transmission method completely changes the traditional packaging technology, where signals must first be transmitted to the PCB and then emitted via the antenna. Under LoP technology, the transmission elements are cleverly embedded in the bottom layer of the package, while the surrounding BGA solder balls provide excellent RF shielding, ensuring that the signals remain intact as they propagate through the PCB waveguide holes to the 3D antenna.
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No. 344, Sanlin Road, Pudong New Area, 200124,Shanghai,China