Sensors

Sensors

Application Overview

Core packaging structure: Glass-to-metal sealing is used to achieve airtight isolation between the pressure chamber and the circuit, protecting sensitive components and withstanding harsh industrial environments. Airtight packaging: Protects sensitive chemical/physical sensing components from corrosive gases or high temperatures, ensuring long-term stable operation.

 

Pressure sensor

The Type 33 sensor is a temperature-compensated silicon piezoresistive sensor housed in a TO-8 metal package, featuring excellent performance and long-term stability.

Differential pressure models are available across the range from 0 to 2 PSI to 0 to 250 PSI. Temperature compensation from 0 to 50°C is achieved through laser-etched resistors. An additional laser-etched resistor is included to adjust the gain of the differential amplifier, thereby correcting for changes in the sensor's pressure sensitivity. This ensures excellent interchangeability at high output levels, with an interchangeability error of only ±1%. 

 

Gas sensor

TO-packaged gas sensors are gas detection instruments developed using TO packaging. TO packaging, also known as coaxial packaging, consists of a TO tube socket and a TO tube cap. The TO tube socket serves as the base for the packaging component and provides power, while the tube cap enables smooth input of external gas. These two components form a protective packaging for the sensitive semiconductor component. The MEMS gas sensor chip, with dimensions not exceeding 3 millimeters in length and width, is mounted on the TO tube socket. By installing the tube socket on an integrated circuit board, the TO-packaged gas sensor chip can function normally.

 

Product Features:

1. Compact size, lightweight, and easy to install, suitable for use in various types of sensors such as air quality monitors and VOC monitors.

2. Stainless steel protective mesh provides high protection, easy cleaning, and effective protection against particles and impurities, making maintenance and use convenient.

3. High-performance chip with breakthrough manufacturing processes, significantly enhancing product performance.

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